FEATURES

• Accommodates MCA (Microchannel Architecture) daughter boards for IBM PS/2 systems
• .050 (1.27) contact spacing with staggered tail bend results in 4 rows at .100 (2.54) spacing
• Accepts .062 (1.57) nominal thickness P.C. board, accurately positioned by card slot barrier 
• High profile insulator body, .610 (15.49)
• Mounting posts provide positive location and retention
• P.C. tail contact termination
• Many other sizes available.  Please contact Edac for additional items.

SPECIFICATIONS

• Insulator Material: polyphenylene sulphide, UL 94V-0, color: Black
• Contact Material: phosphor bronze
• Contact Plating: gold on the mating area, tin on the contact tails, nickel underplate
• Current Rating: 1 amperes continuous
• Contact Resistance: 30 milliohms maximum
• Dielectric Withstanding Voltage: 500 V AC rms @ sea level
• Insulation Resistance: 1000 megohms minimum
• Operating Temperature: -65 to +125 degrees C
• Insertion Force: 8 oz (2.22 N) maximum per contact pair when tested with a .062 (1.57) thick gauge
• Withdrawal Force: 1 oz (0.28 N) minimum per contact pair when tested with a .062 (1.57) thick gauge